| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67098 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65G49-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| filingDate |
2000-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5326f8d6a34c8fe0dfd0f715d64072e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4149d924e371982354fed77ef7e6762a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ca1c779445589f01d3d1cd0b14876f9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ab40d24a9dc9fcebb286f9dbe52fcd3 |
| publicationDate |
2001-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001035813-A |
| titleOfInvention |
Thermally Annealable Copper Electrochemical Deposition Equipment |
| abstract |
PROBLEM TO BE SOLVED: To design a flexible structure that can be expanded to meet future design rules and requirements to fill gaps, and to meet the requirements of other processing systems. An electrochemical deposition system that provides throughput. An electrochemical deposition system includes a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, a rapid thermal anneal chamber disposed adjacent to the loading station, One or more processing cells disposed in association with the frame and an electrolyte source in fluid communication with the one or more processing cells. In one aspect of the invention, a process is provided after an electrochemical deposition process, such as a rapid thermal anneal process. Preferably, there is provided a system controller for controlling the components of the electrochemical deposition system including the electrochemical deposition process and a thermal anneal chamber located adjacent to the loading station. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8277624-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006501360-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021106281-A |
| priorityDate |
1999-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |