http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001026624-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7956e22c9a8643585801f1d4f0538a6f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F8-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-10 |
| filingDate | 1999-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_902e798795ebca2133a330f1fa84d818 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c329f9abf1a70f60eb79d007f244d7a4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46abb55f5836baf67971972417304e72 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dfef1a9748bd8a358b3dfb035ad1f19 |
| publicationDate | 2001-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001026624-A |
| titleOfInvention | Photosensitive resin, photosensitive resin composition and printed wiring board |
| abstract | (57) Abstract: A so-called heat, which is a management of a thermal allowable limit of a degree of curing that can be developed by ultraviolet exposure and a dilute alkali aqueous solution and can be removed during development of an unexposed portion when a coating film is dried. Provide photosensitive resin, photosensitive resin composition and printed wiring board suitable for solder resist film for printed wiring board with wide range of control, high sensitivity, and excellent heat resistance, electrical insulation and chemical resistance I do. A carboxyl group formed by reacting at least one of acrylic acid and methacrylic acid with at least a part of an epoxy group of a polyfunctional epoxy resin, and further reacting at least one of a polybasic acid and an anhydride thereof. 1. A photosensitive resin obtained by reacting a glycidyl compound having at least one unsaturated group in one molecule (excluding glycidyl acrylate or glycidyl methacrylate). A photosensitive resin composition containing the same. A printed wiring board using this composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100935148-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102164977-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101267111-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010102270-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007004334-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8114574-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010050272-A1 |
| priorityDate | 1999-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 131.