Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B49-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-32 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B49-12 |
filingDate |
2000-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b34bf0b224882ab1f3f3303a465896b9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f81e9c554f36b780d324515abcbff4e7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_604a612a5be40000a826f0ea13c11c49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d87be129fe54df535915024d61801f00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7463c06c37997574cb7cac2f580833c |
publicationDate |
2001-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2001025962-A |
titleOfInvention |
Determining when to replace retaining rings used in substrate polishing operations |
abstract |
[PROBLEMS] To provide a substrate polishing apparatus and a method for reducing a processing cost. A holding ring of a polishing apparatus has an inner surface exposed to contact a peripheral edge of a substrate to be polished against a polishing surface, and a bottom surface exposed to contact the polishing surface while the substrate is being polished. And a wear marker indicating a preselected amount of wear on the bottom surface. The inner surface, the bottom surface, and the wear markers can form part of a retaining ring used in a chemical mechanical polishing process. In one method, at least a portion of the retainer can be replaced when one or more substrates are polished against a polishing surface using a retaining ring and the bottom surface is worn by a preselected amount indicated by a wear marker. Good. In another method, one or more substrates are polished against a polishing surface using a wear marker that indicates a preselected amount of wear of the retaining ring, and a warning signal is generated when a wear marker is detected. Is done. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4673547-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101415983-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004154933-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018099772-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107717639-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014504041-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010023122-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101143173-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018531805-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006255851-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7244276-B2 |
priorityDate |
1999-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |