| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-22 |
| filingDate |
1999-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_becb7c6cbd5292eacff82381d0351649
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0b1ec0d021cd1651053dea8f8db0e2b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d983894527b61ee5ce8b1b3026cd67ba |
| publicationDate |
2001-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001011181-A |
| titleOfInvention |
Resin composition for insulating material and insulating material using the same |
| abstract |
(57) Abstract: Provided is an insulating material having excellent thermal and electrical characteristics for use in semiconductors. A component (A) having a photopolymerizable functional group, A resin composition for an insulating material comprising a heat-resistant resin having a glass transition temperature higher than the thermal decomposition temperature of a polymer of (A) or a precursor (B) thereof as an essential component, and an insulating material using the same. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019014907-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0134679-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03024448-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6890626-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003048859-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-1293129-C
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018131601-A |
| priorityDate |
1999-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |