http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001007533-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 1999-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59e4cf4c6b966dc7b5e40e538760d1a6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec1f49e03386fa0b413db996e01fc7ca |
| publicationDate | 2001-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001007533-A |
| titleOfInvention | Manufacturing method of ball grid array type printed wiring board with excellent heat dissipation |
| abstract | (57) Abstract: A printed wiring board having one or two stages of wire bonding pads excellent in heat dissipation and heat resistance after moisture absorption in a printed wiring board. SOLUTION: On a double-sided metal-clad laminate, a plurality of truncated-cone-shaped projections are formed at positions directly opposite to a surface on which a semiconductor chip is mounted, and a second-stage bonding pad and a circuit are formed at other positions. Then, on the front surface, a glass cloth base material prepreg, a copper foil is disposed thereon, and a prepreg and a copper foil having a truncated conical protruding portion are disposed on the back surface. Cutting the fabric base and resin, Create a cavity type printed wiring board. Further, a polyfunctional cyanate resin composition is used as the thermosetting resin composition. [Effect] A ball grid array type with a new structure that is excellent in connectivity between the inner metal core and the outer metal foil layer on the back, heat dissipation, electrical insulation after pressure cooker, migration resistance, etc., and suitable for mass production. A printed wiring board used for a semiconductor plastic package was obtained. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101197102-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013115327-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014045721-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012128269-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5772949-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5928601-B2 |
| priorityDate | 1999-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 66.