http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001007240-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 1999-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59e4cf4c6b966dc7b5e40e538760d1a6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e24284fac1e1bbbc405147d4e3849c8b |
| publicationDate | 2001-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001007240-A |
| titleOfInvention | High heat dissipation type ball grid array type printed wiring board for semiconductor plastic package |
| abstract | (57) [Summary] [Problem] BG excellent in heat dissipation, heat resistance, electrical insulation after moisture absorption, migration resistance, etc. Create printed wiring boards for A-type semiconductor plastic packages. SOLUTION: A glass cloth is formed on a backside copper foil part which becomes a semiconductor chip mounting part by forming a circuit after drilling a through hole and copper plating using a glass cloth base material double-sided copper-clad laminate and forming a circuit by sandblasting. The substrate and the thermosetting resin composition are removed by cutting and plated with a noble metal to obtain a printed wiring board. Further, a polyfunctional cyanate resin composition is used as a resin for the copper-clad laminate and the prepreg. [Effect] A product excellent in heat dissipation, heat resistance, electrical insulation after pressure cooker treatment, migration resistance, etc., and suitable for mass production was obtained. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1928220-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8037596-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8222532-B2 |
| priorityDate | 1999-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 68.