http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001007132-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11334 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11003 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 1999-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b55d3a62eb524584327c6edf3f4eb76 |
| publicationDate | 2001-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001007132-A |
| titleOfInvention | Solder bump forming apparatus, solder ball forming method, and semiconductor device manufacturing method |
| abstract | (57) Abstract: A solder bump forming apparatus capable of manufacturing, at low cost, highly reliable solder bumps arranged at a fine pitch, a solder ball forming method using the solder bump forming apparatus, and a method of forming the solder balls into a semiconductor. Provided is a method for manufacturing a semiconductor device to be transferred to an electrode portion of a wafer. A solder bump forming apparatus having a substrate and a solder ball forming film formed on the substrate, wherein the solder ball forming film has a thickness smaller than a diameter of a solder ball formed in the opening. Formed on the surface, A solder bump forming apparatus having an opening such that the diameter of the opening gradually decreases toward the inside of the opening, a solder ball forming method using the solder bump forming apparatus, and a step of transferring the solder ball to an electrode portion of a semiconductor wafer. Of manufacturing a semiconductor device having the same. |
| priorityDate | 1999-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.