http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001004529-A

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publicationDate 2001-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001004529-A
titleOfInvention Testing equipment
abstract (57) Abstract: A test load that can be applied to an intermetallic interface in joining semiconductor devices is increased as much as possible. An apparatus for testing a force to shear a solder or gold deposit from a substrate to join conductors, the deposit having a diameter in the range of 50-100 micrometers. The shearing tool is provided with a semi-cylindrical cavity having a diameter that closely approximates the average diameter of the area occupied by the weld. The tool is configured to reshape the weldment so that the weldment fits more closely, the reshaping being within a range of less than 30% of the circumference of the weldment and within 10% of the diameter of the weldment. Done in
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