| abstract |
(57) [Summary] a) A first substrate (2) is brought into contact with an electroplating article (4) including a support and a conforming mask patterned on the support, and b) corresponding to a complement of the conforming mask pattern. Electroplating a first metal from a metal ion source electroplating layer (58) on a first substrate in a first pattern, c) removing a first article from the first substrate; An electroplating method is disclosed. The method is used in microfabrication of miniaturized devices and also discloses electroplating articles and apparatus. |