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filingDate 1999-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd32600cdaa43393111b3271c0a22ae1
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publicationDate 2000-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000357738-A
titleOfInvention Wiring structure manufacturing method
abstract (57) Abstract: A wiring structure for a semiconductor device or a micromachine device can be easily manufactured at low cost. A photosensitive resin film is formed on a substrate having a metal wiring. Next, metal wiring 1 A latent image 110 is formed on the photosensitive resin film 107 on the metal wiring 106 by exposing to ultraviolet light 109 using a photomask 108 having a width smaller than 06 and having a light transmitting pattern. At this time, the exposure amount is set according to the undulation of the photosensitive resin film 107. Next, the photosensitive resin film 107 is flattened by performing a developing process under a developing condition in which the difference in film thickness and the difference in etching rate between the latent image 110 portion and the unexposed portion are balanced. Next, the photosensitive resin film 107 is cured by hard baking, and the photosensitive agent is removed.
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