| abstract |
(57) [Solution] An aqueous solution obtained by mixing an epoxy resin composition and pure water has an ionic conductivity of 1 mS / m or less, and the viscosity of a B-staged product is 80 to 100 ° C. 5 0 to 10000 Pa · s, and the cured product of the composition has a coefficient of linear expansion of 10 × 10 −5 mm / mm / ° C. or less; The heat deformation temperature Tg is 100 ° C. or more, A liquid crystal sealing composition having a moisture permeability of 200 g / m 2 · 24 hrs or less at 200 ° C., an epoxy resin having an average of 1.2 or more epoxy groups per molecule, and rubbery polymer particles having a softening point of 0 ° C. or less (diameter of 5 μm or less). , An inorganic filler, a heat-active latent epoxy curing agent, and fine polymer particles having a high softening point (50 ° C. or higher) and a diameter of 2 μm or lower. [Effect] A liquid crystal sealant that exhibits high adhesive seal reliability and can produce homogeneous and high-quality liquid crystal display elements that can be applied to liquid crystal display elements (cells) produced by the single-wafer press-heat bonding method. A composition. |