http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000340913-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
filingDate 1999-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_536a691840d20783868ec8204611afe0
publicationDate 2000-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000340913-A
titleOfInvention Ceramic circuit board
abstract (57) [Summary] An electronic component cannot be firmly connected to a metal circuit board. Kind Code: A1 A ceramic circuit board having a metal circuit board attached to a surface of a ceramic substrate via a brazing material, and a nickel plating layer applied to the surface of the metal circuit board. The nickel plating layer 5 is formed of a nickel-phosphorus amorphous alloy.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10207109-B4
priorityDate 1999-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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