http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000338024-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N29-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N1-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N13-00 |
| filingDate | 1999-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be430bad0577b49f0fdf311a83fad1f3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fafbe833382bbc30babb4740273ad3d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce37a0a5c8063e44f6c52a0b7a2fed3c |
| publicationDate | 2000-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000338024-A |
| titleOfInvention | Evaluation method for semiconductor encapsulation resin and metal |
| abstract | (57) [Problem] To provide an evaluation method for adhesiveness that can cope with peeling of a semiconductor encapsulant and a frame and that shows a clear difference between resins. A metal piece is provided with at least one metal plating of at least one square centimeter at one location, and the metal piece is molded with a resin for semiconductor encapsulation, and peeling from the metal plating surface is observed. To evaluate the adhesiveness between a semiconductor sealing resin and a metal. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105890994-A |
| priorityDate | 1999-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.