| abstract |
(57) [Summary] [Problem] Lamination of electronic / electric parts having high flame retardancy, good heat resistance, moisture resistance, mechanical properties, and excellent productivity, etc., while being halogen-free. To provide an epoxy resin composition that can be used for a board. The diphenylphosphinylphenylene structure contains a phosphorus-containing epoxy resin of a type incorporated in a molecular main chain, a novolak-type epoxy resin, and a curing agent, A halogen-free flame-retardant epoxy resin having an epoxy equivalent of 240 to 800 has solved the above problem. |