http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000327750-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ef01e33058cf740cf2197991be97af1 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
filingDate | 1999-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_425280310dc7f815ecaf4ce1d5e59f56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11327b802d676205db07a1f9aa329c9f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d5c8c4b7eefaed999cf235202e1bdc5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8feb42488d4b194136a9e22f3447c17a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd188d23608f9e81fb8b10ca0ca61e12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b49d67b9ce03b44eaab8d86b0b7a129e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3edd4974bc1f8e2d079ddce2af4fdfb |
publicationDate | 2000-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2000327750-A |
titleOfInvention | Epoxy resin composition and use thereof |
abstract | (57) Abstract: A phosphine oxide compound represented by the following general formula (1) as an essential component as a curing accelerator, an epoxy resin obtained from phenol aralkyl resins, and a hydroxyl group 10 as a curing agent. An epoxy resin composition containing a bifunctional or more functional ester-containing compound or ester-containing resin in which mol% to 100 mol% is esterified by an aromatic acyl group. (In the formula, R 1 to R 6 represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an aryl group or an aralkyl group having 6 to 10 carbon atoms.) [Effect] Unprecedented low moisture absorption is realized. In particular, the present invention provides an epoxy resin composition which provides a package having extremely excellent crack resistance as compared with a conventional cured product, particularly for semiconductor encapsulant applications. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004018720-A |
priorityDate | 1999-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 95.