http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000327035-A

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filingDate 1999-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d58af01597e9b5c91be74f61035411c7
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publicationDate 2000-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000327035-A
titleOfInvention Thermal adhesive lid material and package using the same
abstract (57) [Problem] To provide a heat-adhesive lid material excellent in moisture resistance, oxygen permeability, light-shielding property, low in production cost, and improved in incineration property and shape retention. SOLUTION: The heat-adhesive lid material 1 of the present invention comprises an exterior resin film 2 and an aluminum foil 3 having a thickness of 3 to 18 μm. And a nylon film 4 having a thickness of 2 to 8 times the thickness of the aluminum foil 3 and a heat bonding layer 5.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014172627-A
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type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 25.