http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000319488-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
filingDate | 1999-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7bbcb2f00cc51cbf3bc2788dabe11ed |
publicationDate | 2000-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2000319488-A |
titleOfInvention | Epoxy resin composition and semiconductor device |
abstract | (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation having both high-temperature storage characteristics and flame retardancy. SOLUTION: The surface of an epoxy resin, a phenolic resin, and red phosphorus is coated with aluminum hydroxide, and then a red phosphorus-based flame retardant whose surface is further coated with a phenolic resin is included in the total resin composition in an amount of 0.1 to 5% by weight. %, The amount of bromine in the brominated epoxy resin is 0.1 to 0.5% by weight of the total resin composition, and an inorganic filler and a curing accelerator are essential components. |
priorityDate | 1999-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.