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filingDate 1999-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7bbcb2f00cc51cbf3bc2788dabe11ed
publicationDate 2000-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000319488-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation having both high-temperature storage characteristics and flame retardancy. SOLUTION: The surface of an epoxy resin, a phenolic resin, and red phosphorus is coated with aluminum hydroxide, and then a red phosphorus-based flame retardant whose surface is further coated with a phenolic resin is included in the total resin composition in an amount of 0.1 to 5% by weight. %, The amount of bromine in the brominated epoxy resin is 0.1 to 0.5% by weight of the total resin composition, and an inorganic filler and a curing accelerator are essential components.
priorityDate 1999-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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