http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000319460-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-08
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filingDate 1999-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6429a48523d59864aa20dae887cf39bf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c431f83404eca42cb2980e8eea694eb
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publicationDate 2000-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000319460-A
titleOfInvention Heat resistant composition
abstract PROBLEM TO BE SOLVED: To provide a heat-resistant composition which is less susceptible to thermal deformation and aging at high temperatures, especially an ethylene-vinyl acetate copolymer (EV) The present invention relates to a heat-resistant composition containing (A) and having little heat deformation and aging at high temperatures. SOLUTION: (1) Ethylene-vinyl acetate copolymer (EVA), ethylene-ethyl acrylate copolymer (EEA), ethylene-butyl acrylate copolymer (EBA), ethylene-methyl methacrylate copolymer (EMMA) And / or 100 to 100 parts by weight of a thermoplastic resin composition containing these mixtures, (2) 0.01 to 2 parts by weight of a radical scavenger, and (3) acid modification of a resin having a higher melting point than (1). It is a heat-resistant composition characterized by adding 0.05 to 30 parts by weight of a substance.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9779855-B2
priorityDate 1999-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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