| abstract |
(57) [Problem] To provide a thermosetting resin composition which is compatible with fast curing properties and storage stability and is useful in the field of electric and electronic materials. SOLUTION: A compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, and one molecule of tetraphenylphosphonium (X), Compound (Y) having two phenolic hydroxyl groups in the molecule has a structure of a molecular aggregate formed by 2 to 2.5 molecules, and the compound (Y) has one of the phenolic hydroxyl groups. A thermosetting resin composition comprising, as an essential component, a molecular compound (C) comprising a phenoxide-type compound as a conjugate base. |