http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000315750-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 1999-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e24284fac1e1bbbc405147d4e3849c8b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59e4cf4c6b966dc7b5e40e538760d1a6 |
| publicationDate | 2000-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000315750-A |
| titleOfInvention | Manufacturing method of ball grid array type printed wiring board excellent in heat dissipation |
| abstract | (57) [Problem] To provide a method for manufacturing a printed wiring board which is excellent in heat dissipation, popcorn phenomenon, mass productivity, etc. in the printed wiring board. SOLUTION: A plurality of truncated cone-shaped projections are provided at positions directly opposite to a surface on which a semiconductor chip is mounted on a double-sided copper-clad laminate, Circuits are formed in other places, then prepregs and copper foils with hollowed out truncated conical protrusions are placed, and after lamination molding, the surface copper foil, organic base material, and resin are cut to expose the metal surface. Create a cavity type printed wiring board. Further, a polyfunctional cyanate resin composition is used as the thermosetting resin composition. [Effect] A ball grid array with a novel structure that is excellent in connectivity between the inner metal plate and the outer metal foil layer on the back, heat dissipation, electrical insulation after pressure cooker, migration resistance, etc., and suitable for mass productivity. The printed wiring board used for the mold semiconductor plastic package was obtained. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112752432-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005202382-A |
| priorityDate | 1999-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 70.