| abstract |
PROBLEM TO BE SOLVED: To simultaneously achieve the stability of a polishing rate, the step characteristics, the reduction of defects generated on a surface to be polished for various polishing objects, and the environmental problems and cost reduction. Provided is a polishing method and apparatus with a small load. In a method of polishing a device wafer, a first polishing step of polishing the device wafer by a first fixed abrasive polishing method, and a second polishing step different from the first fixed abrasive polishing method. And a finish polishing step of polishing by the fixed abrasive polishing method 14b. |