| abstract |
PROBLEM TO BE SOLVED: To provide a composition for producing an insulating thin film, which has a low dielectric constant and can be used for a semiconductor multilayer wiring structure, its use, and its production method. SOLUTION: An alkoxysilane is used as a raw material, a hydrolysis reaction of the alkoxysilane is performed in a specific range of a molar ratio of the alkoxysilane and water, and a condensing rate is controlled to a specific range in a subsequent condensation reaction. The precursor of the obtained silica sol is subjected to a gelling reaction in the presence of an organic polymer, and is once formed into a silica gel / organic polymer composite (hybrid) thin film. Then, a porous silica thin film obtained by removing the organic polymer from the hybrid thin film by heating and baking. |