| abstract |
(57) [Problem] To provide a flexible wiring board that ensures sufficient connection reliability when connected to a semiconductor element by wire bonding. SOLUTION: The dynamic Vickers hardness of a gold pad provided on a flexible wiring board is 50 or more, or The ratio of (nickel content (atomic weight%) in gold pad surface / gold thickness (μm)) is 5 or less, or the dynamic Vickers hardness of the gold pad is 50 or more, and (the gold pad surface Nickel content (atomic weight%) / gold thickness (μ m)) is 5 or less. |