| abstract |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate in which the reliability of an electrical assembly having a flip chip is improved, the number of steps and materials used during the manufacturing are reduced, and a method of manufacturing the same. Aim. The method of processing a semiconductor substrate according to the present invention includes a step of forming a laminate including a conductive region, a polymer layer, and a release layer, wherein the polymer layer is provided between the semiconductor substrate and the circuit layer. Can be An aperture is formed between the polymer layer and the release layer to expose the conductive region. Within the aperture, the solder composition is reflowed to form solder bumps. The polymer layer serves as a passivation layer for chips obtained from a semiconductor substrate. |