| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate |
1999-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4661976a16b2ae37502dff7dac60e02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1c82eae8915bd24bc11648345c29826 |
| publicationDate |
2000-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2000309681-A |
| titleOfInvention |
Resin composition for semiconductor encapsulation, semiconductor device using the same, and method of manufacturing semiconductor device |
| abstract |
(57) [Problem] To provide a resin composition for semiconductor encapsulation which is excellent in moisture resistance reliability and storage stability and also excellent in discharge and application workability. A resin composition for semiconductor encapsulation containing the following components (A) to (D), wherein the viscosity of the resin composition for semiconductor encapsulation is 7000 poise or more at 25 ° C. and 80 ° C. It was set to 5000 poise or less. (A) Liquid epoxy resin. (B) Solid phenolic resin. (C) Latent curing accelerator. (D) an inorganic filler. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012119918-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015080059-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015080059-A1 |
| priorityDate |
1999-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |