| abstract |
[PROBLEMS] To provide a semiconductor device and a semiconductor device manufacturing method using an electronic component lead frame which does not contain lead which is an environmentally harmful pollutant and has good solder wettability and good bonding strength characteristics. SOLUTION: The present invention provides a lead frame formed of nickel or a nickel alloy, copper or a copper alloy, and iron or an iron alloy, wherein an inner lead portion is provided with a surface treatment layer of silver or an alloy containing silver, and an outer lead is provided. In at least the part, the glossiness is 0.6 or more, the crystal orientation index of silver and the (220) plane is 1.5 or more and 5 or less, the crystal orientation index of the (211) plane is 0.9 or less, and The problem is solved by forming a surface treatment layer of an alloy containing tin having a body-centered square structure in which the crystal orientation index of the (200) plane is 0.5 or more. |