| abstract |
PROBLEM TO BE SOLVED: To appropriately set bonding conditions when a chip element is face-down bonded to a resin base, to widen a margin, and to realize stable and highly reliable bonding. SOLUTION: A connection electrode of a chip element CP is ultrasonic-bonded to a wiring electrode provided on a resin substrate 10 so that When the chip element CP is mounted on the resin substrate 10, the ratio of the elastic modulus εh when heated to the elastic modulus εr of the resin substrate 10 at room temperature is 1> εh / εr ≧ A heater 5 for heating the resin substrate 10 to a temperature of 0.5 is provided. The heater 5 can be provided on the substrate mounting table 4 side. |