http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000302846-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_585ee4d9a14c5df01e545ffc2ea93612 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G14-067 |
| filingDate | 1999-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_034f2abf6e24ac9e608b4165cd186b06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_084a6eec410075c063b5b93ae08651cf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7bdbe482015c616275bb49345fac9b43 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d22677c45800264172ef8097b99b7dab |
| publicationDate | 2000-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000302846-A |
| titleOfInvention | Flame retardant epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | (57) Abstract: A modified phenolic resin obtained by polycondensing an epoxy resin (A), heavy oils or pitches, phenols and formaldehyde compounds in the presence of an acid catalyst, wherein the hydroxyl group is The equivalent is 150-300 and 150 Curing agent (B) containing a modified phenol resin having a melt viscosity at 40 ° C. of 40 poise or less, a flame-retardant epoxy resin composition for semiconductor encapsulation containing a specific content of an inorganic filler (C), and this resin composition Semiconductor device sealed with a cured product of the above. [Effect] The hydroxyl equivalent of the present invention is 150 to 300 and 1 An epoxy resin composition containing a modified phenolic resin having a melt viscosity at 50 ° C. of 40 poises or less can provide a molding material having excellent flame retardancy and having a very small effect on the environment. In addition, a semiconductor device having excellent flame retardancy and solder heat resistance can be provided by using this. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002220435-A |
| priorityDate | 1999-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 96.