http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000301658-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8de772e5c6c44844b546733f251fc2bc |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00 |
| filingDate | 1999-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1fec6c0a3ab5c33cb14d55e85c402256 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d32d309b6f0bf8c4b9a731e8a1fdc523 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74f52aa18e6eb5ab5f06255b68c2944c |
| publicationDate | 2000-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000301658-A |
| titleOfInvention | Resin-coated Cu-plated steel sheet with excellent solderability and corrosion resistance |
| abstract | (57) [Summary] [Object] To provide a resin-coated Cu-plated steel sheet which suppresses deterioration with time of solderability and exhibits good corrosion resistance after soldering. [Constitution] This resin-coated Cu-plated steel sheet has a thermal decomposition temperature of 80 to 200 ° C by an organic resin flux, A 0.5 to 2 μm thick film made of an aqueous resin having a thermal decomposition temperature of the resin itself of 250 ° C. or higher is formed on the surface of the Cu plating layer. 5-30 as needed for the film forming resin It is possible to incorporate a weight percent mild flux or a chromium compound having a Cr adhesion amount of 5 to 20 mg / m 2 . |
| priorityDate | 1999-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.