| abstract |
(57) [Summary] (Solution) [SOLUTION] (A) The solubility in a liquid epoxy resin, (B) an inorganic filler, and (C) an epoxy resin is 1% by weight. Below, the melting point is 170 ° C. or more, and the average particle size is 1 to 5 μm, the following general formula (1) having a maximum particle size of 20 μm or less: (Wherein R 1 and R 2 represent a hydrogen atom, a methyl group, an ethyl group, Shows the hydroxymethyl group or a phenyl group, R 3 is a methyl group, an ethyl group, a phenyl group or represents an allyl group, R 4 Is a hydrogen atom or the following formula (2) Is a group represented by A sealing material for a flip-chip type semiconductor device, comprising a liquid epoxy resin composition containing a curing accelerator represented by the formula (1) as a main component. The sealing material for a flip-chip type semiconductor device of the present invention has excellent thin film penetration characteristics and storage stability, and the flip-chip type semiconductor device sealed using this sealing material is very reliable. It is highly likely. |