http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000290351-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0cdb395105a75f1b0346cc31b81fade1
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G14-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
filingDate 1999-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abb17ac1beb237ce272b145b279acd7b
publicationDate 2000-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000290351-A
titleOfInvention Epoxy resin curing agent
abstract PROBLEM TO BE SOLVED: To provide an epoxy resin curing agent which is excellent in heat resistance, reduced in bending elastic modulus and water absorption without lowering bending strength, low in stress and excellent in moisture resistance. SOLUTION: A weight ratio of an alkylbenzene-aldehyde resin (A) obtained by reacting an alkylbenzene and an aldehyde in the presence of an acid catalyst and a phenol (Z) is 1 ≦. After reacting in the presence of an acid catalyst at (Z) / (A) ≦ 20, It is characterized by comprising a phenol-alkylbenzene-aldehyde resin obtained by reacting a bifunctional aldehyde (Y) with a phenol (Z) at a molar ratio of 0.1 ≦ (Y) / (Z) <0.8. Epoxy resin curing agent.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008047613-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2857378-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009242480-A
priorityDate 1999-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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