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filingDate 1999-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f67b080f725f45c76836bc4533671d9
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publicationDate 2000-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000285731-A
titleOfInvention Method of manufacturing conductor paste and ceramic multilayer substrate
abstract (57) [Problem] To provide a conductor paste which has a low resistance value, does not cause defects such as voids and cracks, and provides a via conductor having excellent quality performance by using a ceramic multilayer substrate technology. To manufacture a ceramic multilayer substrate having excellent quality performance. SOLUTION: A conductive paste 20 containing Ag powder having an average particle diameter of 3 to 10 μm and comprising 95% by weight or more of the entirety of the conductive powder and an organic vehicle, and containing no glass frit, is passed through a via hole of a green sheet 10. Fill into 12, Heat shrinkage suppression sheets 30 on both sides of green sheet laminate S Are laminated and fired to obtain a ceramic multilayer substrate, so that the sintering behavior of the green sheet 10 and the conductive paste 20 is less likely to be shifted.
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