http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000277910-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| filingDate | 1999-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9630c110f1a5db0b0f6fb5d46d8d8d46 |
| publicationDate | 2000-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000277910-A |
| titleOfInvention | Manufacturing method of wiring board |
| abstract | (57) [Summary] A blister or the like is generated on an insulating base by gaseous organic substances discharged from a power supply wiring layer or a grounding wiring layer during firing. A plurality of light-cured ceramic sheets having through holes are formed by irradiating a predetermined position of a photosensitive ceramic green sheet with light, and a wiring conductor layer is formed on at least one of the light-cured ceramic sheets. 4a are connected to at least one other photocured ceramic sheet 1a by a power supply wiring layer or a grounding wiring layer 6 and a groove 7; After that, this is laminated and fired at the same time. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022108386-A1 |
| priorityDate | 1999-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 197.