http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000277553-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13017 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 1999-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e385fa7caacb69b7e35beb72863057f |
| publicationDate | 2000-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000277553-A |
| titleOfInvention | Semiconductor chip, method for forming bumps on semiconductor chip, semiconductor device and method for manufacturing the same, circuit board, and electronic equipment |
| abstract | [PROBLEMS] To provide a semiconductor chip having a bump excellent in adhesion to a resin, a method of forming a bump on a semiconductor chip, a semiconductor device and a method of manufacturing the same, a circuit board, and an electronic device. . A semiconductor chip has a plurality of electrodes, and bumps are provided on each of the electrodes. At a central portion 27 of the bump 24 in the height direction, a concave portion 29 which is recessed inward from the upper end portion 26 and the lower end portion 28 is formed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3734674-A4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111542930-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11641010-B2 |
| priorityDate | 1999-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689 |
Total number of triples: 20.