http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000273158-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 1999-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a8a9aba2de4d5beea6a0fd22b61699f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1654ce92148b37e645be68e58c91d41 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db8c3b14f2a530f7b3d7075aad27e308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b63c6f31f9d9f92b277d51e6aadcee6d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b408a4fe242c580a6f0b6aad937fd31 |
| publicationDate | 2000-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000273158-A |
| titleOfInvention | Thermosetting resin composition |
| abstract | (57) [Problem] To provide a thermosetting resin composition which is compatible with fast curing properties and storage stability and is useful in the field of electric and electronic materials. SOLUTION: A compound having two or more epoxy groups in one molecule (A), a compound having two or more phenolic hydroxyl groups in one molecule (B), and tetraphenylphosphonium tetraphenylborate (X) are generally used. The compound (Y) represented by the formula (1) is compounded with a molar ratio of X: Y of 1: 2 to A thermosetting compound (C) obtained by thermally reacting the compound (C) in the range of 4, or a compound (D) obtained by further thermally reacting the compound (C) in a solvent having a boiling point of 60 ° C. or higher. Resin composition. Embedded image |
| priorityDate | 1998-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.