http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000265041-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 1999-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c582af4953dc949de558535887f88655 |
| publicationDate | 2000-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000265041-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation excellent in moldability and solder resistance. (A) a crystalline epoxy resin, (B) a phenolic resin represented by the formula (1), (C) an inorganic filler, And (D) an epoxy resin composition for semiconductor encapsulation, wherein the resin composition contains a curing accelerator as an essential component, and the crystallinity of the crystalline epoxy resin in the resin composition is 0 to 70%. . Embedded image (N is an average value and a positive number up to 0 or 8) |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010132766-A |
| priorityDate | 1999-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.