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publicationDate 2000-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000256642-A
titleOfInvention Conductive adhesive and semiconductor device using the same
abstract (57) [Problem] To provide a conductive adhesive excellent in thermal stress relaxation effect and excellent in workability and storage stability for the purpose of improving the reliability of electronic components. SOLUTION: (A) A dimethylpolysiloxane having a hydroxyphenyl group at each end and an epoxy-modified silicone compound having a molecular weight of 12000 to 26000 at both ends and comprising a mononuclear bisphenol F type epoxy resin, and (B) diallyl A conductive adhesive containing bisphenol F and dicyandiamide, (C) 2-phenyl-4-methyl-5-hydroxymethylimidazole, and (D) a conductive filler as essential components, supporting a semiconductor element and a lead frame or a substrate. Join the members.
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