| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9f8d2c54eb3f61af08e82568018c8e3b |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D53-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D53-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-30 |
| filingDate |
1999-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26f0c768b1d6d966f06fa57ee450c948
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58b8d83261de826c4fb393b40d8fc46a |
| publicationDate |
2000-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2000255620-A |
| titleOfInvention |
Heat sealing material |
| abstract |
(57) [Problem] To provide a heat-sealing lid material which does not generate curl and has good single-wafer separation properties. SOLUTION: A cover material 1 in which a heat bonding resin layer 3 is provided on a base material 2 In the above, a thermo-adhesive synthetic resin film in which irregularities 3a are previously formed is used as the thermo-adhesive resin layer 3. |
| priorityDate |
1999-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |