http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000255619-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D53-04
filingDate 1999-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26f0c768b1d6d966f06fa57ee450c948
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58b8d83261de826c4fb393b40d8fc46a
publicationDate 2000-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000255619-A
titleOfInvention Heat sealing material
abstract (57) [Problem] To provide a heat-sealing lid material which does not generate curl and has good single-wafer separation properties. A heat sealing material (10) is formed by forming a discontinuous concave part (11a) or a convex part (11b) on a laminated body (1) provided with a heat bonding resin layer on the outer surface of a base material, and performing unprocessed flattening during the molding. A part 12 is provided.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013082464-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004025659-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3169611-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11142379-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4511104-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11325760-B2
priorityDate 1999-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 24.