http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000248158-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 1999-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5f8f8e23ca13c153ae6c73ea5011629 |
| publicationDate | 2000-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000248158-A |
| titleOfInvention | Method for producing epoxy resin composition for semiconductor encapsulation |
| abstract | (57) [Summary] Epoxy resin, curing agent, inorganic filler, In a method for producing an epoxy resin composition for semiconductor encapsulation comprising heating and kneading a release agent and a curing accelerator, an epoxy resin, a curing agent, and an inorganic filler are preliminarily heated and kneaded, and then separated into the kneaded material. A method for producing an epoxy resin composition for semiconductor encapsulation, comprising mixing a mold agent and a curing accelerator and further heating and kneading the mixture. According to the present invention, in an epoxy resin composition in which it is essential to add a flexibility-imparting agent and to increase the amount of an inorganic filler, which have tended to significantly deteriorate the releasability of a semiconductor device in a conventional manufacturing method. In addition, the releasability can be improved without lowering the fluidity and the reliability. The production method of the present invention In particular, when the inorganic filler is highly filled (for example, 200 to 10 parts by weight based on a total of 100 parts by weight of the epoxy resin and the curing agent). 00 parts by weight). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7384682-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7161724-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2012017571-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103052687-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7321005-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7560501-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019106812-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012017571-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019214653-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7192997-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111406084-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111406084-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019106812-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7136121-B2 |
| priorityDate | 1999-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.