http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000248049-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
filingDate | 1999-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2734ad61dedaae0120a04c766000f23 |
publicationDate | 2000-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2000248049-A |
titleOfInvention | Epoxy resin composition and semiconductor device |
abstract | (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation excellent in moldability and solder crack resistance. SOLUTION: The essential components are a crystalline epoxy resin, a phenol resin obtained by polycondensing a petroleum heavy oil or pitches, a formaldehyde polycondensate and a phenol in the presence of an acid catalyst, an inorganic filler and a curing accelerator. An epoxy resin composition for semiconductor encapsulation, wherein the crystallinity of the crystalline epoxy resin in the epoxy resin composition is 0 to 70%. |
priorityDate | 1999-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.