| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a44b381217b2f7de8ec5e5e88d44dabc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1407
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-465
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate |
1999-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d70a05afa9505a0a386dd0a7c0d19cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28f7916aecf92e4ec404cd5163a16100 |
| publicationDate |
2000-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2000232269-A |
| titleOfInvention |
Printed wiring board and method for manufacturing printed wiring board |
| abstract |
(57) [Summary] (Modifications) [Problem] Although a via hole of a conventional build-up method printed wiring board has a conductor on a side wall, since the via hole is filled with resin, electric power is supplied on the same grid. It was not possible to form a via hole having an electrical connection, and it was necessary to arrange a lead-out land. SOLUTION: In a build-up method printed wiring board in which an insulating layer 4 having a via hole 5 is applied to an insulating substrate on which a conductor pattern is formed, the via hole is filled with a conductor formed by electroless nickel plating. I do. |
| priorityDate |
1999-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |