| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-10 |
| filingDate |
1999-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f7350ebbcd3aab1e8124059b59d2b45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40bdfca18ca8e0d05e7a069817f3dee5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3af280f816f19d47c9a20fcf7ca04a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93ffe0d644ff6d5072cb1c85ba5527df |
| publicationDate |
2000-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2000230113-A |
| titleOfInvention |
Epoxy resin composition, laminated film and semiconductor device using this epoxy resin composition |
| abstract |
(A) The binuclear body is 10% by weight or less, 3 to 5%. Epoxy resin (B) inorganic filler (C) curing catalyst (D) having a total weight of nuclei of 50% by weight or more and a weight average molecular weight / number average molecular weight of 1.7 or less; An epoxy resin composition comprising: an uncured material having a glass transition temperature of less than 15 ° C. Effect In the epoxy resin composition of the present invention, by controlling the molecular weight distribution of the epoxy resin, it is possible to lower the glass transition temperature of the uncured product without lowering the heat resistance and moisture resistance of the cured product. By using this epoxy resin composition, a film that is flexible and has good workability can be obtained. It is possible to obtain a laminated film of two or more layers in which a layer is laminated and other layers are adhered according to the application, and by covering the semiconductor element with this film, a semiconductor having good heat resistance, moisture resistance and low stress property is obtained. A device is obtained. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000297199-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009096894-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012146830-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020174179-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011014717-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015174874-A |
| priorityDate |
1998-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |