http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000230037-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-14 |
| filingDate | 1999-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_befdaab17cf122cbce2f9b802c42ab69 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5bf6f2446a564f027272aa503aa25cde http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30db319ccfde82fee2f3ad0e224fd312 |
| publicationDate | 2000-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000230037-A |
| titleOfInvention | Polyamide-imide resin composition and film-forming material |
| abstract | (57) [Summary] [PROBLEMS] While maintaining low warpage, it is excellent in flexibility, adhesion to a sealant, solvent resistance and chemical resistance, and is soluble in non-nitrogen-containing polar solvents. Provided is a polyamide-imide resin composition having low-temperature curability and excellent in heat resistance, electrical properties, moisture resistance, workability, and economy, and a film-forming material containing the same. (A) (a) a tri- or higher valent polycarboxylic acid having an acid anhydride group or a derivative thereof, and (b) a general formula (I) [Wherein, a plurality of Rs each independently have 1 to 12 carbon atoms. A plurality of X each independently represents an alkylene group having 1 to 12 carbon atoms or an arylene group, m and n each independently represent an integer of 1 to 20], and 100 parts by weight of a polyamideimide resin obtained by reacting a dicarboxylic acid having a number average molecular weight of 1,000 to 10,000 and (c) a polyisocyanate compound. And (B) a polyamide-imide resin composition containing 1 to 50 parts by weight of an epoxy resin, and a film-forming material containing the polyamide-imide resin composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019026769-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007291334-A |
| priorityDate | 1999-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.