http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000228582-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 1999-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecd4611456f1baab9e1f971fe64f294a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6067b0bb69604ac7b27d222adb57edf1 |
| publicationDate | 2000-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000228582-A |
| titleOfInvention | Method for manufacturing printed wiring board having through hole with excellent reliability |
| abstract | (57) [Abstract] [Problem] To directly irradiate a high-output carbon dioxide laser to a copper-clad plate to make a small diameter through-hole, and to improve the connection reliability between the copper foil inside the hole and the surface copper foil. increase. SOLUTION: A resin layer containing a metal oxide powder, a metal compound powder, a carbon powder, or a metal powder in an amount of 3 to 97 vol% on a copper foil of a copper clad board having at least two or more copper layers. Alternatively, after arranging a resin layer with a total thickness of 30 to 200 μm applied to the film, directly irradiating a high-output carbon dioxide gas laser selected from 20 to 60 mJ / pulse, processing and removing the copper foil, and forming a through hole The copper foil front and back surfaces and the generated burrs were removed by etching, the inside of the hole was subjected to gas phase treatment, and then wet treatment, and 80% The printed wiring board is prepared using the copper clad board obtained by filling the holes by the copper plating. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003168860-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015041728-A |
| priorityDate | 1999-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 81.