| abstract |
(57) [Problem] A heat having low dielectric constant and low dielectric loss tangent for use in printed wiring, excellent adhesiveness to metal, extremely small scattering of resin during work, and a film forming ability. Laminating material for circuits that becomes a resin film or a metal foil with a resin base using a curable low dielectric resin composition. SOLUTION: Component (a): a siloxane-modified polyimide in which structural units represented by the formulas (2a), (2b) and (2c) are arranged; and component (b): a formula (b-1) or the like. It has a resin substrate layer containing a compound and a component (c): a compound having two or more maleimide groups, and a peelable film. Embedded image Embedded image |