http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000218668-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1374dd16777534b65ad4422333245af8 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K67-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-673 |
| filingDate | 1999-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed50006de0f841ff1fec15c608348534 |
| publicationDate | 2000-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000218668-A |
| titleOfInvention | Manufacturing method of jig for semiconductor transportation |
| abstract | PROBLEM TO BE SOLVED: To prevent impurities from leaking out onto the surface of a jig for semiconductor transfer and generation of volatile gas when heat-treating the jig for semiconductor transfer, and do not hinder the surface contamination of a semiconductor product such as a silicon wafer. A semiconductor transfer jig is provided using a vent-type injection molding machine having a vent hole for discharging a gas component generated from a molten thermoplastic resin in a heating cylinder. A method of manufacturing a jig for transporting semiconductors, comprising: |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004217898-A |
| priorityDate | 1999-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 42.