| abstract |
[57] [Problem] Compared with conventional technology, surface contamination of adherends such as stainless steel plate and plastic plate due to exudation of low molecular compounds, and silicon wafer due to elution or exudation of metal ions, halogen ions, etc. The present invention provides a pressure-sensitive adhesive having good antistatic properties without causing contamination of the adherend. A pressure-sensitive adhesive comprising an alkyl (meth) acrylate copolymer having at least one quaternary ammonium / organic acid group in a molecular side chain. |