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filingDate 1999-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57c4cf158e85fe22c1d69f400e74ad8e
publicationDate 2000-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000212399-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract (57) [Summary] [Problem] Even if stored at room temperature, the fluidity does not decrease. An object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation which is excellent in curability at the time of molding, wrinkle characteristics and island shift characteristics, and has good solder crack resistance. SOLUTION: Essential components are an epoxy resin represented by the formula (1), a phenol resin, a curing accelerator containing 50 to 100% by weight of a compound represented by the formula (2) in a total curing accelerator, and fused spherical silica. The number of epoxy groups in all epoxy resins is 1.1 to 1.4 based on the number of phenolic hydroxyl groups in all phenolic resins, and the particle size in fused spherical silica is 60 μm. An epoxy resin composition for encapsulating a semiconductor, wherein 1% by weight or more is 1% by weight or less and 10% by weight or more is 40 to 100% by weight or more. Embedded image (R 1 is a hydrogen atom, a methyl group, an ethyl group, a butyl group, Or a halogen atom, and R 1 s may be the same or different. )
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005248087-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014005359-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011185730-A
priorityDate 1999-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 47.