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filingDate 1999-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67dabd36424b692f70d53c8f01e86e05
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publicationDate 2000-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000212259-A
titleOfInvention Liquid phenolic resin and method for producing the same
abstract [PROBLEMS] To provide a liquid phenol based epoxy resin having a low viscosity suitable as a curing agent for an epoxy resin for a semiconductor liquid encapsulant and having a high glass transition temperature when used as an epoxy resin curing agent. Provision of resin. SOLUTION: The phenolic hydroxyl group in a phenolic polymer (base polymer) obtained by reacting a phenol (A), a xylylene compound (B), and an aromatic aldehyde or ketone (C) is 10 to 60%. Allylic phenolic resin obtained by allylic etherification of a phenolic nucleus, or a allylic phenolic phenolic resin having a structure in which 0.1 to 2 allyl groups are substituted for one phenol nucleus in the base polymer. resin. A method for producing a nuclear allylated phenolic resin by Claisen rearrangement of an allyl etherified product of a base polymer.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007106928-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018145273-A
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